Packaged surface mount (SMT) chips having matched top contacts and bottom contacts are stacked. Chip features are selected to provide the desired connectivity between chip layers with a greater ease of manufacture. In one embodiment, additional spacing and routing layers are optionally provided between...http://www.google.fr/patents/US6849480?utm_source=gb-gplus-shareBrevet US6849480 - Surface mount IC stacking method and device
