A method for making multi-tier laminate substrates for electronic device packaging is provided wherein a spacing mechanism is used to protect the bond fingers of a trace on a lower tier of the laminated substrate when a milling bit is used to cut an opening above a die cavity in the multi-tier substrate....http://www.google.fr/patents/US5798014?utm_source=gb-gplus-shareBrevet US5798014 - Methods of making multi-tier laminate substrates for electronic device packaging
Methods of making multi-tier laminate substrates for electronic device ...
