A polishing system can have a rotatable platen, a polishing pad secured to the platen, a carrier head to hold a substrate against the polishing pad, and an eddy current monitoring system including a coil or ferromagnetic body that extends at least partially through the polishing pad. A polishing pad...http://www.google.fr/patents/US7591708?utm_source=gb-gplus-shareBrevet US7591708 - Method and apparatus of eddy current monitoring for chemical mechanical polishing
Method and apparatus of eddy current monitoring for chemical mechanical ...
