A chemical mechanical polishing apparatus includes a rotating plate on which a substrate is received, and a polishing pad which moves across the substrate as it rotates on the plate to polish the substrate. The load of the pad against the substrate, and the rotary speed of the plate, may be varied to...http://www.google.fr/patents/US6179690?utm_source=gb-gplus-shareBrevet US6179690 - Substrate polishing apparatus
