A method of encapsulating a plurality of OLED devices fabricated upon a substrate is described, the steps of said method comprising: fabricating a plurality of OLED devices on a substrate; depositing at least one planarization layer upon said OLED devices; hardening said at least one planarization layer...http://www.google.fr/patents/US20030205845?utm_source=gb-gplus-shareBrevet US20030205845 - Encapsulation for organic light emitting diodes devices
Encapsulation for organic light emitting diodes devices
Numéro de demande: 10/137,163 Numéro de publication: US 2003/0205845 A1 Date de dépôt: 2 mai 2002 Brevet délivré: US6949389 ( Date de délivrance 27 sept. 2005)
