A quad flat no-lead (QFN) grid array semiconductor package and method for making the same is disclosed. The package includes a semiconductor die and a lead frame having a plurality of conductive elements patterned in a grid-type array. A plurality of bond pads on the semiconductor die is coupled to the...http://www.google.fr/patents/US6967125?utm_source=gb-gplus-shareBrevet US6967125 - Quad flat no lead (QFN) grid array package, method of making and memory module and computer system including same
Quad flat no lead (QFN) grid array package, method of making and memory ...
