The present invention provides an ultrathin thin film integrated circuit and a thin film integrated circuit device including the thin film integrated circuit device. Accordingly, the design of a product is not spoilt while an integrated circuit formed from a silicon wafer, which is thick and produces...http://www.google.fr/patents/US20040164302?utm_source=gb-gplus-shareBrevet US20040164302 - Thin film integrated circuit device IC label, container comprising the thin film integrated circuit, manufacturing method of the thin film integrated circuit device, manufacturing method of the container, and management method of product having the container
Thin film integrated circuit device IC label, container comprising the thin ...
Numéro de demande: 10/781,795 Numéro de publication: US 2004/0164302 A1 Date de dépôt: 20 févr. 2004 Brevet délivré: US7973313 ( Date de délivrance 5 juil. 2011)
