Method and apparatus for utilizing a probe card for testing in-wafer photonic integrated circuits (PICs) comprising a plurality of in-wafer photonic integrated circuit (PIC) die formed in the surface of a semiconductor wafer where each PIC comprises one or more electro-optic components with formed wafer-surface...http://www.google.fr/patents/US7792396?utm_source=gb-gplus-shareBrevet US7792396 - Probe card for testing in-wafer photonic integrated circuits (PICs) and method of use
Probe card for testing in-wafer photonic integrated circuits (PICs) and ...
