A method for forming a semiconductor device includes forming a conductive bump on one or more of pads of a semiconductor substrate. A top or uppermost portion of each conductive bump is then planarized. The exposed portions of a main surface of the semiconductor wafer are filled with a layer of encapsulation...http://www.google.fr/patents/US5933713?utm_source=gb-gplus-shareBrevet US5933713 - Method of forming overmolded chip scale package and resulting product
Method of forming overmolded chip scale package and resulting product
