A high-density electronic package module is disclosed which comprises a stack of semiconductor chips having integrated circuitry on each chip. To permit the emplacement of thin film circuitry on the access ends, each access plane is etched to cut back the semiconductor material then covered with passivation...http://www.google.fr/patents/US4525921?utm_source=gb-gplus-shareBrevet US4525921 - High-density electronic processing package-structure and fabrication
High-density electronic processing package-structure and fabrication
