A process for providing a plurality free-standing resilient contact structures (spring elements) mounted to a surface of a carrier substrate. The carrier substrate is mounted to a surface of a semiconductor device, or one or more unsingulated semiconductor dies. Bond pads of the semiconductor...http://www.google.fr/patents/US6168974?utm_source=gb-gplus-shareBrevet US6168974 - Process of mounting spring contacts to semiconductor devices
Process of mounting spring contacts to semiconductor devices
