The present invention pertains to apparatus and methods for planarization of metal surfaces having both recessed and raised features, over a large range of feature sizes. The invention accomplishes this by increasing the fluid agitation in raised regions with respect to recessed regions. That is, the...http://www.google.fr/patents/US20020074238?utm_source=gb-gplus-shareBrevet US20020074238 - Method and apparatus for uniform electropolishing of damascene ic structures by selective agitation
Method and apparatus for uniform electropolishing of damascene ic structures ...
Numéro de demande: 09/967,075 Numéro de publication: US 2002/0074238 A1 Date de dépôt: 28 sept. 2001 Brevet délivré: US6709565 ( Date de délivrance 23 mars 2004)
