A pad configuration for surface mounted components having contact pads along the periphery thereof includes a plurality of interior pads distributed in a grid with the period of interior pads being three quarters of the period of the peripheral pads multiplied by an integer greater than 1....http://www.google.fr/patents/US4600970?utm_source=gb-gplus-shareBrevet US4600970 - Leadless chip carriers having self-aligning mounting pads
Leadless chip carriers having self-aligning mounting pads
