A method of providing a hermetically sealed enclosure for a highly moisture sensitive electronic device including depositing an electrical conductor on the substrate which provides an electrical connection with the electronic device and depositing an electrically insulating thin layer over the electrical...http://www.google.fr/patents/US20020187254?utm_source=gb-gplus-shareBrevet US20020187254 - Ultrasonically sealing the cover plate to provide a hermetic enclosure for OLED displays
Ultrasonically sealing the cover plate to provide a hermetic enclosure for ...
Numéro de demande: 09/850,788 Numéro de publication: US 2002/0187254 A1 Date de dépôt: 8 mai 2001 Brevet délivré: US6706316 ( Date de délivrance 16 mars 2004)
