An integrated circuit package includes a semiconductor chip, bonding pads on the semiconductor chip, a metal lead frame contacting electrically with the semiconductor chip, a plurality of wired pins wire-bonded respectively to the bonding pads, and at least one non-wired pin. The non-wired pin is wire-bonded...http://www.google.fr/patents/US5715127?utm_source=gb-gplus-shareBrevet US5715127 - Method for preventing electrostatic discharge failure in an integrated circuit package
Method for preventing electrostatic discharge failure in an integrated ...
