A method for cleaning the surface of a semiconductor wafer by removing residual slurry particles adhered to the wafer surface after chemical-mechanical polishing is provided. The semiconductor wafer is subjected to a first polishing step using a basic aqueous solution of a nonionic...http://www.google.fr/patents/US5704987?utm_source=gb-gplus-shareBrevet US5704987 - Process for removing residue from a semiconductor wafer after chemical-mechanical polishing
Process for removing residue from a semiconductor wafer after chemical ...
