The package comprises a plurality of metal/polymer laminates whereby electronic components or functional units may be directly attached or plugged into laminated elements to form a unitary package. An element or thermal transposer is included in the package to minimize thermal expansion mismatch between...http://www.google.fr/patents/US3952231?utm_source=gb-gplus-shareBrevet US3952231 - Functional package for complex electronic systems with polymer-metal laminates and thermal transposer
Functional package for complex electronic systems with polymer-metal ...
