Apparatus for electrostatic clamping of a semiconductor wafer in a vacuum processing chamber wherein an ion beam is applied to the wafer. In a first embodiment, the apparatus includes an electrically conductive platen, a resilient, thermally-conductive dielectric layer affixed to the platen and one or...http://www.google.fr/patents/US5452177?utm_source=gb-gplus-shareBrevet US5452177 - Electrostatic wafer clamp
