A methodology is described by which a processing chamber used to deposit plasma-enhanced Ti-CVD films may be conditioned and passivated efficiently after either a wet cleaning or in-situ chemical cleaning, or after each successive deposition sequence. The technique allows a CVD process, such as, for...http://www.google.fr/patents/US6635569?utm_source=gb-gplus-shareBrevet US6635569 - Method of passivating and stabilizing a Ti-PECVD process chamber and combined Ti-PECVD/TiN-CVD processing method and apparatus
Method of passivating and stabilizing a Ti-PECVD process chamber and ...
