An integrated circuit (IC) package is disclosed. The IC package includes a substrate having top, middle and bottom layers, an array of millimeter-wave antennas embedded on the top layer of the substrate and a monolithic microwave integrated circuit (MMIC) mounted on the bottom layer of the substrate....http://www.google.fr/patents/US7675465?utm_source=gb-gplus-shareBrevet US7675465 - Surface mountable integrated circuit packaging scheme
