Flux is supplied to the surface of each land by a flux supplying apparatus. A solder ball having a predetermined size is supplied onto a land by using a ball supplying apparatus. A memory IC is disposed on a logic IC and each of a plurality of external leads comes into contact with a predetermined position...http://www.google.fr/patents/US6852571?utm_source=gb-gplus-shareBrevet US6852571 - Method of manufacturing stacked semiconductor device
Method of manufacturing stacked semiconductor device
