Structures, in various embodiments, are provided using capacitive techniques to reduce noise in high speed interconnections, such as in CMOS integrated circuits. In an embodiment, a transmission line is disposed on a first layer of insulating material, where the first layer of insulating has a thickness...http://www.google.fr/patents/US20060261438?utm_source=gb-gplus-shareBrevet US20060261438 - CAPACITIVE TECHNIQUES TO REDUCE NOISE IN HIGH SPEED INTERCONNECTIONS
CAPACITIVE TECHNIQUES TO REDUCE NOISE IN HIGH SPEED INTERCONNECTIONS
