A semiconductor package including a top-surface metal layer for implementing circuit features provides improvements in top-surface interconnect density, more flexible routing and mounting of top surface semiconductor packages, dies and passive components or a conformal shield cap implementation. The...http://www.google.fr/patents/US7633765?utm_source=gb-gplus-shareBrevet US7633765 - Semiconductor package including a top-surface metal layer for implementing circuit features
Semiconductor package including a top-surface metal layer for implementing ...
