A method of nondestructively testing electronic chips adapted for direct attachment to metallized pads on circuitized substrate is disclosed, wherein an electrically conductive liquid eutectic joint is formed at room temperature with low pressure between electrical terminals on the chip and pads on the...http://www.google.fr/patents/US5007163?utm_source=gb-gplus-shareBrevet US5007163 - Non-destructure method of performing electrical burn-in testing of semiconductor chips
Non-destructure method of performing electrical burn-in testing of ...
