A method for forming a stud bumped semiconductor die is disclosed. The method includes forming a ball at the tip of a coated wire passing through a hole in a capillary, where the coated wire has a core and an oxidation-resistant coating. The formed ball is pressed to the conductive region on the semiconductor...http://www.google.fr/patents/US7271497?utm_source=gb-gplus-shareBrevet US7271497 - Dual metal stud bumping for flip chip applications
Dual metal stud bumping for flip chip applications
