A method of making a semiconductor chip assembly includes providing a post and a base, mounting a first adhesive on the base including inserting the post through an opening in the first adhesive, mounting a conductive layer on the base including aligning the post with an aperture in the conductive layer,...http://www.google.fr/patents/US8003416?utm_source=gb-gplus-shareBrevet US8003416 - Method of making a semiconductor chip assembly with a post/base heat spreader and dual adhesives
Method of making a semiconductor chip assembly with a post/base heat ...
