The present invention provides a technique for manufacturing a low cost device that provides a true die to external fiber optic connection. Specifically, the present invention relates to several techniques for joining an optical device package to a semiconductor device package. The first technique involves...http://www.google.fr/patents/US20040048417?utm_source=gb-gplus-shareBrevet US20040048417 - Techniques for joining an opto-electronic module to a semiconductor package
Techniques for joining an opto-electronic module to a semiconductor package
Numéro de demande: 10/652,805 Numéro de publication: US 2004/0048417 A1 Date de dépôt: 29 août 2003 Brevet délivré: US6838317 ( Date de délivrance 4 janv. 2005)
