A wire-bonding method of an IC uses a capillary having a hole for guiding a bonding wire, the capillary moving vertically and horizontally with respect to the IC so as to bridge a loop between a first bonding and a subsequent second bonding of the wire on predetermined places. The method comprises the...http://www.google.fr/patents/US5226582?utm_source=gb-gplus-shareBrevet US5226582 - Method for wire-bonding an integrated circuit
