The present invention provides a technique to reduce and suppress scratches and delamination, to suppress and control the development of dishing and erosion, and to polish at high polishing rate. Polishing is performed using a polishing solution, which contains an oxidizer, phosphoric acid, organic acid,...http://www.google.fr/patents/US6750128?utm_source=gb-gplus-shareBrevet US6750128 - Methods of polishing, interconnect-fabrication, and producing semiconductor devices
Methods of polishing, interconnect-fabrication, and producing semiconductor ...
