Methods of fabricating multilayer circuits are presented. In accordance with the present invention, a plurality of circuit layers comprised of a dielectric substrate having a circuit formed thereon are stacked, one on top of the other. The dielectric substrate is composed of a polymeric material capable...http://www.google.fr/patents/US5046238?utm_source=gb-gplus-shareBrevet US5046238 - Method of manufacturing a multilayer circuit board
Method of manufacturing a multilayer circuit board
