An electronic package and information handling system utilizing same wherein the package substrate includes an internally conductive layer coupled to an external pad and of a size sufficiently large enough to substantially prevent cracking, separation, etc. of the pad when the pad is subjected to a tensile...http://www.google.fr/patents/US6815837?utm_source=gb-gplus-shareBrevet US6815837 - Electronic package with strengthened conductive pad
Electronic package with strengthened conductive pad
