Disclosed herein is a method of manufacturing a package substrate with a fine circuit pattern using anodic oxidation. By anodizing a metal core which is opened through a masking process, oxidation layers are formed in open areas of the metal core to insulate portions of circuit pattern from each other....http://www.google.fr/patents/US7169707?utm_source=gb-gplus-shareBrevet US7169707 - Method of manufacturing package substrate with fine circuit pattern using anodic oxidation
Method of manufacturing package substrate with fine circuit pattern using ...
