Temporary connections to spring contact elements extending from an electronic component such as a semiconductor device are made by urging the electronic component, consequently the ends of the spring contact elements, vertically against terminals of an interconnection substrate, or by horizontally urging...http://www.google.fr/patents/US20060223345?utm_source=gb-gplus-shareBrevet US20060223345 - SOCKETS FOR "SPRINGED" SEMICONDUCTOR DEVICES
