A chip structure comprises a substrate, a first built-up layer, a passivation layer and a second built-up layer. The substrate includes many electric devices placed on a surface of the substrate. The first built-up layer is located on the substrate. The first built-up layer is provided with a first dielectric...http://www.google.fr/patents/US7470988?utm_source=gb-gplus-shareBrevet US7470988 - Chip structure and process for forming the same
