A method of bonding a flexible circuitized substrate to a circuitized substrate (e.g., printed circuit board) to interconnect selected circuitry of both substrates using solder. Solder paste is applied over conductive pads on the circuitized substrate and organic dewetting material (e.g., epoxy coating)...http://www.google.fr/patents/US5203075?utm_source=gb-gplus-shareBrevet US5203075 - Method of bonding flexible circuit to cicuitized substrate to provide electrical connection therebetween using different solders
Method of bonding flexible circuit to cicuitized substrate to provide ...
