By forming MOSFETs on a substrate having pre-existing ridges of semiconductor material (i.e., a “corrugated substrate”), the resolution limitations associated with conventional semiconductor manufacturing processes can be overcome, and high-performance, low-power transistors can be reliably and repeatably...http://www.google.fr/patents/US7265008?utm_source=gb-gplus-shareBrevet US7265008 - Method of IC production using corrugated substrate
Method of IC production using corrugated substrate
