A linear polishing belt for use in chemical-mechanical polishing (CMP) of a substrate comprises an opening and a flexible monitoring window secured to the belt to close the opening and to create a monitoring channel in the belt. A plurality of monitoring channels can also be used. A film thickness monitor...http://www.google.fr/patents/US6146248?utm_source=gb-gplus-shareBrevet US6146248 - Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisher
Method and apparatus for in-situ end-point detection and optimization of a ...
