A semiconductor chip has such a structure as to have first connection electrodes formed at its upper circumferential edge portion and each exposed over a corresponding opening in a protective layer. An insulating layer is formed on the semiconductor chip except at each opening in the protective layer....http://www.google.fr/patents/US5925931?utm_source=gb-gplus-shareBrevet US5925931 - Semiconductor device having interconnect lines and connection electrodes formed in groove portions of an insulating layer
Semiconductor device having interconnect lines and connection electrodes ...
