A low stress, low profile, cavity down wire bond or flip-chip BGA package is formed by injection molding or thermosetting of liquid crystal plastic (LCP) to form a die carrier including a polymer solder grid array (PSGA) of standoff posts formed during molding of the die carrier. The standoff posts are...http://www.google.fr/patents/US6414849?utm_source=gb-gplus-shareBrevet US6414849 - Low stress and low profile cavity down flip chip and wire bond BGA package
Low stress and low profile cavity down flip chip and wire bond BGA package
