A method of removing photoresist material from a semiconductor substrate includes providing a semiconductor substrate having a patterned photoresist mask. A layer comprised of polymer material is formed over the patterned photoresist mask. The layer comprised of polymer material and a portion of the...http://www.google.fr/patents/US6653058?utm_source=gb-gplus-shareBrevet US6653058 - Methods for reducing profile variation in photoresist trimming
Methods for reducing profile variation in photoresist trimming
