Within a method for removing from over a substrate a chemical mechanical polish (CMP) residue layer there is first provided a substrate. There is then formed over the substrate: (1) a chemical mechanical polish (CMP) substrate layer having an aperture formed therein; (2) a chemical mechanical polish...http://www.google.fr/patents/US6376377?utm_source=gb-gplus-shareBrevet US6376377 - Post chemical mechanical polish (CMP) planarizing substrate cleaning method employing enhanced substrate hydrophilicity
Post chemical mechanical polish (CMP) planarizing substrate cleaning method ...
