Since the power-supply and/or signal-transmission wiring layers connected to the semiconductor chip regions are formed, each individual integrated circuit can be burned in on the semiconductor wafer and, in other words, an integrated circuit can be burned in on a wafer level. The integrated circuit can...http://www.google.fr/patents/US5294776?utm_source=gb-gplus-shareBrevet US5294776 - Method of burning in a semiconductor device
