One embodiment of the present invention concerns a test assembly for testing product circuitry of a product die. In one embodiment, the test assembly includes at test die and an interconnection substrate for electrically coupling the test die to a host controller that communicates with the test die....http://www.google.fr/patents/US6551844?utm_source=gb-gplus-shareBrevet US6551844 - Test assembly including a test die for testing a semiconductor product die
Test assembly including a test die for testing a semiconductor product die
