Methods and apparatus for processing substrates to improve polishing uniformity, improve planarization, remove residual material and minimize defect formation are provided. In one aspect, a method is provided for processing a substrate having a conductive material and a low dielectric constant material...http://www.google.fr/patents/US6821881?utm_source=gb-gplus-shareBrevet US6821881 - Method for chemical mechanical polishing of semiconductor substrates
Method for chemical mechanical polishing of semiconductor substrates
