A carrier structure for fabricating a stacked-type semiconductor device includes: a lower carrier that has laminated thin plates and has first openings for mounting first semiconductor packages thereon; and an upper carrier having second openings for mounting second semiconductor packages on the first...http://www.google.fr/patents/US7489029?utm_source=gb-gplus-shareBrevet US7489029 - Carrier structure for stacked-type semiconductor device, method of producing the same, and method of fabricating stacked-type semiconductor device
Carrier structure for stacked-type semiconductor device, method of producing ...
