Laser system and method for material processing with ultra fast lasers are provided. One aspect of the invention features the method which removes at least a portion of a target structure such as a memory link while avoiding undesirable damage to adjacent non-target structures. The method includes applying...http://www.google.fr/patents/US20040226925?utm_source=gb-gplus-shareBrevet US20040226925 - Laser system and method for material processing with ultra fast lasers
Laser system and method for material processing with ultra fast lasers
Numéro de demande: 10/787,517 Numéro de publication: US 2004/0226925 A1 Date de dépôt: 26 févr. 2004 Brevet délivré: US6979798 ( Date de délivrance 27 déc. 2005)
