There are disclosed a stacked package formed by stacking semiconductor device packages and a manufacturing method thereof. Each package includes leads and connection terminals. A semiconductor chip is electrically connected to the connection terminals. A package body has the same thickness as that of...http://www.google.fr/patents/US6878570?utm_source=gb-gplus-shareBrevet US6878570 - Thin stacked package and manufacturing method thereof
Thin stacked package and manufacturing method thereof
