Multichip and single chip modules are presented as well as a chips first fabrication of such modules. The multichip module comprises a plurality of chips affixed in a planar array by a structural material which surrounds the sides of the chips such that the upper surfaces of the chips and an upper...http://www.google.fr/patents/US5841193?utm_source=gb-gplus-shareBrevet US5841193 - Single chip modules, repairable multichip modules, and methods of fabrication thereof
Single chip modules, repairable multichip modules, and methods of ...
