A method of making a laminated structure includes forming a first lamination having first and second conductive layers having inner and outer surfaces and being spaced apart by a dielectric layer, drilling through the first conductive layer and dielectric layer to form a blind via having a bottom coexistent...http://www.google.fr/patents/US5879787?utm_source=gb-gplus-shareBrevet US5879787 - Method and apparatus for improving wireability in chip modules
Method and apparatus for improving wireability in chip modules
