A method of making an assembly package having an airtight cavity for housing an electrical element, such as a semiconductor chip. The method includes bonding a shell to a conductive base with a thermally setting alpha-staged epoxy resin which is characterized as being a gel in the uncured...http://www.google.fr/patents/US5801074?utm_source=gb-gplus-shareBrevet US5801074 - Method of making an air tight cavity in an assembly package
Method of making an air tight cavity in an assembly package
